Moldflow Analysis

      The product 3D mold flow analysis will be done according to customer's requirements or our own experience in order to get the best gate position and molding conditions, optimize the mold design, decrease the mold repairs, reduce the prototype cost, avoid potential manufacturing defects, and get innovative products to market faster. 

      Below are portion of some moldflow analysis cases:

Large Product Multi-gating Analysis

填充时间（Fill time）                                              注塑压力（Pressure）

                             LCD Back Enclosure Moldflow Analysis（Single Point Hot Sprue Gating）

填充时间（Fill time）                         注塑压力（Pressure）                    易困气的位置（Air Trap）

Back Enclosure Moldflow Analysis

                                      填充时间（Fill time）                                               冷却分析（Cooling analysis）

Medical Device Back Enclosure Moldflow Analysis（Two Points Open Hot Sprue Gating）

                         壁厚分析（Mesh Thickness Diagnostic）                             体积温度（Bulk temperature）

                                填充时间1（Fill time1）                                                       填充时间2（Fill time2）

                                                                 Back Enclosure Moldflow Analysis

                       填充时间（Fill time）                        成型压力（Pressure）                      体积温度（Bulk temperature）